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    Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs) 

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002:;page 85
    Author(s): S. A. Taylor; K. Chen; R. Mahajan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended ...
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