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RISDesign Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” Here, a virtual flip chip ball grid array (FC-BGA) is examined in comparison to ...
Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Canary structures being used as early warning indicators represent an important tool for condition and health monitoring of electronic components and systems. In this paper, printed circuit boards (PCBs) with canary ...