Search
Now showing items 1-7 of 7
Air Flow and Heat Transfer in Fan Cooled Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, measurements of surface temperature and air velocity are presented for the case of a printed circuit board with heated metal elements in a fan-induced flow. Surface temperature ...
The Effect of Reynolds Number on Microaxial Flow Fan Performance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microscale axial flow fans were investigated in response to the growing cooling requirements of the electronics industry. The two main challenges of this investigation were manufacture of a fully ...
Development of Compact Thermal–Fluid Models at the Electronic Equipment Level
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The introduction of compact thermal models (CTM) into computational fluid dynamics (CFD) codes has significantly reduced computational requirements when representing complex, multilayered, and ...
An Experimental Investigation of the Flow Fields Within Geometrically Similar Miniature-Scale Centrifugal Pumps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flow fields within two miniature-scale centrifugal pumps are measured and analyzed to facilitate an understanding of how scaling influences performance. A full-scale pump, of impeller diameter ...
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper analyzes the scale effects that occur in miniature centrifugal flow fans and investigates the possibility of optimizing blade geometry so that performance can be enhanced. Such fans ...
Thermal Management of Low Profile Electronic Equipment Using Radial Fans and Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There is an increasing need for low profile thermal management solutions for applications in the range of 5–10W, targeted at portable electronic devices. This need is emerging due to enhanced ...
Forced Convection Board Level Thermal Design Methodology for Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically ...