Abstract: Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests, measuring a thermal resistance value for a single component on a standard ...

Abstract: The thermal resistance of electronic components is known to often differ considerably between standard test conditions and those found in service. One way to correct for this is to use ...

Abstract: The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically ...