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RISA Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper introduces a simplified modeling scheme for the prediction of heat transport capability of heat pipes and vapor chambers. The modeling scheme introduced in this paper enables thermal ...
Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports the measurement of the thermal conductivity of particle-laden polymeric thermal interface materials for three different particle volume fractions. The experimental data are further ...
Heat Sink Effect on System Pressure and Mass Flow Rate in a Pumped Refrigerant Loop
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pumped refrigerant loops (PRL) which are aimed at eventually cooling electronics often reject heat to a vapor compression cycle. A vapor compression cycle (VCC) uses a proportional, integral, ...
Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports the test results of vapor chambers using copper post heaters and silicon die heaters. Experiments were conducted to understand the effects of nonuniform heating conditions ...
Microchannel Two-Phase Flow Oscillation Control With an Adjustable Inlet Orifice
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work describes the experimental setup, method, and results of utilizing a micrometer to move an adjustable orifice immediately in front of an array of microchannels. Research by others ...