YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-4 of 4

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 14
    Author(s): Randy D. Weinstein; Amy S. Fleischer; Kimberly A. Krug
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures (60°C and 100°C above ambient) on single circuit boards (FR4 and ...
    Request PDF

    Transient Thermal Management of a Handset Using Phase Change Material (PCM) 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004:;page 419
    Author(s): Marc Hodes; Randy D. Weinstein; Lou Manzione; Calvin Chen; Stephen J. Pence; Jason M. Piccini
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems ...
    Request PDF

    The Experimental Exploration of Embedding Phase Change Materials With Graphite Nanofibers for the Thermal Management of Electronics 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 004:;page 42405
    Author(s): Randy D. Weinstein; Thomas C. Kopec; Amy S. Fleischer; Elizabeth D’Addio; Carol A. Bessel
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: To improve the thermal performance of phase change materials (PCMs), graphite nanofibers were embedded into a paraffin PCM. The thermal effects of graphite fiber loading levels (0–5wt%) and ...
    Request PDF

    Quantification of the Impact of Embedded Graphite Nanofibers on the Transient Thermal Response of Paraffin Phase Change Material Exposed to High Heat Fluxes 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 007:;page 71901
    Author(s): Kireeti Chintakrinda; Randy D. Weinstein; Amy S. Fleischer; Ronald J. Warzoha
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Paraffin phase change material (PCM) is enhanced with suspended graphite nanofibers at high loading levels. The loading levels reach in excess of 10% by weight. The thermal effects of the ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    ... View More

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian