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RISThermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C ...
Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed circuit boards populated with twenty-five 0.4 mm pitch, 256-pin plastic quad flat packs (QFP) containing no-clean and water-clean solder joints were subjected to thermal cycling in order ...