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    Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM) 

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 003:;page 197
    Author(s): R. C. Dunne; S. K. Sitaraman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The thermomechanical behavior of a new multilayered substrate with embedded passive components is the focus of this study. Such structures are typically susceptible to localized interfacial stresses ...
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    Estimating the Effects of Traffic Congestion on Fuel Consumption and Vehicle Emissions Based on Acceleration Noise 

    Source: Journal of Transportation Engineering, Part A: Systems:;2007:;Volume ( 133 ):;issue: 002
    Author(s): I. D. Greenwood; R. C. Dunn; R. R. Raine
    Publisher: American Society of Civil Engineers
    Abstract: While significant progress has occurred in quantifying congestion costs within the sphere of traffic engineering, little progress has been made to incorporate such costs into network-level highway evaluation systems. The ...
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    DSpace software copyright © 2002-2015  DuraSpace
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