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    The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002:;page 122
    Author(s): E. H. Wong; R. Rajoo; S. W. Koh; T. B. Lim
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress ...
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