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    Thermal Resistances of Circular Source on Finite Circular Cylinder With Side and End Cooling 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 169
    Author(s): M. M. Yovanovich; Distinguished Professor Emeritus; Principal Scientific Advisor
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: General solution for thermal spreading and system resistances of a circular source on a finite circular cylinder with uniform side and end cooling is presented. The solution is applicable for ...
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    Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003:;page 233
    Author(s): J. R. Culham; Associate Professor and Director; T. F. Lemczyk; Project Engineer; M. M. Yovanovich; Professor Emeritus and Principal Scientific Advisor
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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