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RISMicro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void ...
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper illustrates the micromechanics approach to cyclic creep-fatigue damage of Pb-Sn, developed by the authors with the help of a simple case study. It is demonstrated that durability ...