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    Special Issue on Poly’2000, London 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004:;page 317
    Author(s): Bernd Michel; Guest Editor; Poly’2000 Co-chair; Kikuo Kishimoto; Guest Editor; Poly’2000 Co-chair
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experts from the Polymeric Materials community from four continents met in December, 2000 at the Third International Workshop, Poly’2000 in London. The Poly conference series is sponsored by ...
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    DSpace software copyright © 2002-2015  DuraSpace
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian