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    Optimal Design for PPF Heat Sinks in Electronics Cooling Applications 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 410
    Author(s): Han-Ting Chen; Jenn-Tsong Horng; Po-Li Chen; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed ...
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    Design Optimization for Pin-Fin Heat Sinks 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004:;page 397
    Author(s): Han-Ting Chen; Ying-Huei Hung; Po-Li Chen; Jenn-Tsong Horng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An effective method for performing the thermal optimization of fully confined pin-fin heat sinks under constraints of pressure drop, mass, and space limitations has been successfully developed. ...
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    Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 370
    Author(s): Ta-Wei Lin; Ming-Chang Wu; Cheng-Hsien Peng; Po-Li Chen; Ying-Huei Hung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal characteristics for a horizontal heated chip mounted with three types of nominally flat silicon-based heat spreaders have been systematically investigated. They include the natural convective ...
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