Abstract: Finite element simulations are broadly utilized to calculate the thermally induced mechanical deformations of interconnecting solder materials in electronics. The Anand unified viscoplasticity model is a prevalent choice ...

Abstract: An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for platemountedonstandoffs boundary conditions scheme was required, ...

Abstract: In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board ...