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RISA General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ubiquitous eutectic tin-lead (Sn–Pb) solder alloys are soon to be replaced with lead-free alternatives. In light of this transition, new computational tools for predicting the fatigue life ...
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A unified creep plasticity damage (UCPD) constitutive model was developed to predict the fatigue of 95.5Sn–3.9Ag–0.6Cu solder joints. Compression, stress-strain and creep properties were generated ...
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A general fatigue life prediction methodology, based on a unified creep plasticity damage (UCPD) model, was developed for predicting fatigue cracks in 95.5Sn–3.9Ag–0.6Cu (wt %) solder interconnects. ...