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    On the Stability of Plane Parallel Flow Between Differentially Heated, Tilted Planes 

    Source: Journal of Applied Mechanics:;1974:;volume( 041 ):;issue: 003:;page 554
    Author(s): P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The linear and energy theories of stability of a plane parallel, antisymmetric flow between differentially heated, tilted planes are examined. The linear and energy results do not coincide ...
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    Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003:;page 212
    Author(s): Wei Qin; Ira M. Cohen; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the latest generation of wire bonders, the cycle is so short that the wand electrode is kept stationary and the electronic flame off (EFO) discharge is from the side of the wire. This ...
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    Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003:;page 220
    Author(s): K. J. Zwick; P. S. Ayyaswamy; I. M. Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this part the heat, mass, and momentum transfer within a curing over that is commonly used in microelectronic manufacturing have been numerically analyzed. The local partial pressure of the ...
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    Heat Transfer in Wire Bonding Process 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 001:;page 44
    Author(s): M. A. Jog; I. M. Cohen; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding ...
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    Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001:;page 34
    Author(s): M. A. Jog; I. M. Cohen; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: During normal power cycling of the electronic equipment, the differing coefficients of thermal expansion result in differential elongations. Because each level of packaging is subject to mounting ...
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    Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003:;page 215
    Author(s): K. J. Zwick; I. M. Cohen; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A curing oven that is commonly used in microelectronic manufacturing has been analyzed to determine the causes of contamination of parts passing through the oven, and to eliminate this ...
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    Heat Transport Mechanisms in Vascular Tissues: A Model Comparison 

    Source: Journal of Biomechanical Engineering:;1986:;volume( 108 ):;issue: 004:;page 324
    Author(s): J. W. Baish; K. R. Foster; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We have conducted a parametric comparison of three different vascular models for describing heat transport in tissue. Analytical and numerical methods were used to predict the gross temperature ...
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    Perfused Phantom Models of Microwave Irradiated Tissue 

    Source: Journal of Biomechanical Engineering:;1986:;volume( 108 ):;issue: 003:;page 239
    Author(s): J. W. Baish; K. R. Foster; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The theoretical basis, practical design considerations, and prototype testing of a perfused model suitable for simulation studies of microwave heated tissue are presented. A parallel tube heat ...
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    Small-Scale Temperature Fluctuations in Perfused Tissue During Local Hyperthermia 

    Source: Journal of Biomechanical Engineering:;1986:;volume( 108 ):;issue: 003:;page 246
    Author(s): J. W. Baish; K. R. Foster; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We develop analytical expressions (scaling laws) for the local temperature fluctuations near isolated and countercurrent blood vessels during hyperthermia. These scaling laws relate the magnitude ...
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    Bubble Motion in a Blood Vessel: Shear Stress Induced Endothelial Cell Injury 

    Source: Journal of Biomechanical Engineering:;2009:;volume( 131 ):;issue: 007:;page 74516
    Author(s): K. Mukundakrishnan; D. M. Eckmann; P. S. Ayyaswamy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Mechanisms governing endothelial cell (EC) injury during arterial gas embolism have been investigated. Such mechanisms involve multiple scales. We have numerically investigated the macroscale flow ...
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