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RISDesign of Thermal Ground Planes for Cooling of Foldable Smartphones
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of ...
Design of Thermal Ground Planes for Cooling of Foldable Smartphones
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of ...