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RISOn the Chemo-Mechanical Polishing (CMP) of Si3N4 Bearing Balls With Water Based CeO2 Slurry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Among various abrasives investigated for the chemo-mechanical polishing (CMP) of Si3 N4 balls (Jiang, 1998), cerium oxide (CeO2 ) was found to be the most effective polishing medium (even ...