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    Flexure and Twist Test Reliability Assurance of Flexible Electronics 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003:;page 031121-1
    Author(s): Lall, Pradeep; Narangaparambil, Jinesh; Leever, Ben; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Additively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance ...
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    Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21117-1
    Author(s): Lall, Pradeep; Narangaparambil, Jinesh; Soni, Ved; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible electronics is emerging as a new consumer-industry phenomenon. The promise of additively printed flexible electronics has sparked interest in a detailed understanding of the parameters and interactions of the ...
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    Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041113-1
    Author(s): Lall, Pradeep; Thomas, Tony; Yadav, Vikas; Narangaparambil, Jinesh; Liu, Wei
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The use of flexible electronics wearable applications has prompted the need to understand the stresses imposed during human motion for a range of activities. Wearable applications may involve situations in which the ...
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