Abstract: Parts on the circuit board serve as reinforcements and produce local stiffness, which influences the deflection of the assembly under vibration. The curvature of the circuit board, combined with ...

Abstract: The disturbed state concept (DSC) with the hierarchical single surface (HISS) plasticity model have been proposed and validated previously for a wide range of problems in electronic packaging. ...

Abstract: The use of PBGA (plastic ball grid array) electronic packages has been greatly increased in the last decade due to high I/O densities offered. The fatigue life prediction for them is a ...