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Ultraminiaturized Three-Dimensional IPAC Packages With 100 μm Thick Glass Substrates for Radio Frequency Front-End Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents innovative compact three-dimensional integrated passive and active components (3D IPAC) packages with ultrathin glass substrates for radio frequency (RF) long-term evolution (LTE) front-end modules ...