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    Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21112-1
    Author(s): Lall, Pradeep; Soni, Ved; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The demand for wearable consumer electronics, fitness accessories, and biomedical equipment has led to the growth research and development of thin flexible batteries. Wearable equipment and other asset monitoring applications ...
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    Partitioned Coupling for Structural Acoustics 

    Source: Journal of Vibration and Acoustics:;2020:;volume( 142 ):;issue: 001:;page 011012-1
    Author(s): Bunting, Gregory; Miller, Scott T.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We expand the second-order fluid–structure coupling scheme of Farhat et al. (1998, “Load and Motion Transfer Algorithms for 19 Fluid/Structure Interaction Problems With Non-Matching Discrete Interfaces: Momentum and Energy ...
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    Automated Underway Eddy Covariance System for Air–Sea Momentum, Heat, and CO2 Fluxes in the Southern Ocean 

    Source: Journal of Atmospheric and Oceanic Technology:;2016:;volume( 033 ):;issue: 004:;page 635
    Author(s): Butterworth, Brian J.; Miller, Scott D.
    Publisher: American Meteorological Society
    Abstract: ruggedized closed-path eddy covariance (EC) system was designed for unattended direct measurements of air?sea momentum, heat, and CO2 flux, and was deployed on the Research Vessel Icebreaker (RV/IB) Nathaniel B. Palmer ...
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    Friction Surfacing Deposition by Consumable Tools 

    Source: Journal of Manufacturing Science and Engineering:;2021:;volume( 143 ):;issue: 012:;page 0120801-1
    Author(s): Seidi, Ebrahim; Miller, Scott F.; Carlson, Blair E.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Friction surfacing is a new variation of friction stir processing for surface property modification of metallic substrates. There is an increasing body of literature about friction surfacing by deposition of metal from a ...
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    Flexure and Twist Test Reliability Assurance of Flexible Electronics 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003:;page 031121-1
    Author(s): Lall, Pradeep; Narangaparambil, Jinesh; Leever, Ben; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Additively printed flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the intended use. There is a dearth of standards for testing and reliability assurance ...
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    Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21119-1
    Author(s): Lall, Pradeep; Goyal, Kartik; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The transition of additive printed electronics into high-volume production requires process consistency to allow quality control of the manufactured product. Process recipes are needed for multilayer substrates with z-axis ...
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    Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21117-1
    Author(s): Lall, Pradeep; Narangaparambil, Jinesh; Soni, Ved; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible electronics is emerging as a new consumer-industry phenomenon. The promise of additively printed flexible electronics has sparked interest in a detailed understanding of the parameters and interactions of the ...
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    On Estimating the Surface Wind Stress over the Sea 

    Source: Journal of Physical Oceanography:;2018:;volume 048:;issue 007:;page 1533
    Author(s): Mahrt, Larry; Miller, Scott; Hristov, Tihomir; Edson, James
    Publisher: American Meteorological Society
    Abstract: AbstractOur study analyzes measurements primarily from two Floating Instrument Platform (FLIP) field programs and from the Air?Sea Interaction Tower (ASIT) site to examine the relationship between the wind and sea surface ...
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    Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications 

    Source: Journal of Electronic Packaging:;2023:;volume( 145 ):;issue: 001:;page 11109-1
    Author(s): Lall, Pradeep; Choudhury, Padmanava; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production ...
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    Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41116-1
    Author(s): Lall, Pradeep; Bimali, Sabina; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The demand for compact, lightweight, and stretchable printed electric circuits has increased with the advancement of flexible printing technology in electronics. The viability of environmentally friendly water-based inks ...
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