Search
CSV
RISScaling Anomaly in the Mechanical Response in Microscale Reverse Extrusion of Copper
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The continuing trend of device miniaturization brings increasing demand for small metal parts and, consequently, significant interest in microscale metal forming technologies. In this work, the influence of grain size on ...
Roll Molding of Microchannel Arrays on Al and Cu Sheet Metals: A Method for High Throughput Manufacturing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The method of roll molding is proposed as an alternative to compression molding for lowcost, highthroughput manufacturing of metalbased microchannel structures. Elemental aluminumand copperbased microchannel arrays with ...
Quantification of Thermal Resistance of Transient Liquid Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu Based Microchannel Heat Exchangers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Transient liquid phase (TLP) bonding of Cu structures with a thin elemental Al intermediate bonding layer is being used to assemble Cubased, enclosed, microchannel heat exchangers (MHEs). The heterogeneous Cu/Al/Cu TLP ...