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    Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components 

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003:;page 31001
    Author(s): Meng, Jingshi; Dasgupta, Abhijit
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Portable electronic devices are commonly exposed to shock and impact loading due to accidental drops. After external impact, internal collisions (termed “secondary impacts” in this study) between vibrating adjacent ...
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    Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Modeâ€‌ Deformations in the Printed Wiring Board 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001:;page 10914
    Author(s): Meng, Jingshi; Dasgupta, Abhijit
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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