Abstract: Variation of processing conditions on warpage prediction of a plastic quad flat package (PQFP) is examined. Thermal mismatch between package constituent materials is the major cause of IC package ...

Abstract: Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important ...

Abstract: A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the ...