Abstract: An analytical model is derived for the calculation of thermo-mechanical induced stresses in area array flip chip assemblies. This analytical model is based on structural mechanics and has the ...

Abstract: Heat sinks with liquid forced convection in microchannels are targeted for cooling electronic devices with a high dissipated power density. Given the inherent stability problems associated with ...

Abstract: Finite element modeling is widely used for estimating the solder joint reliability of electronic packages. In this study, the electronic package is a CSP mounted on a printed circuit board ...