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    A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film 

    Source: Journal of Engineering Materials and Technology:;2002:;volume( 124 ):;issue: 002:;page 274
    Author(s): Martin Y. M. Chiang; Chwan K. Chiang; Wen-li Wu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A technique for determining the in-plane modulus and the coefficient of thermal expansion (CTE) of supported thin films has been developed. The modulus and CTE are calculated by solving two ...
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    Assessment of Sandwich Beam in Three-Point Bending for Measuring Adhesive Shear Modulus 

    Source: Journal of Engineering Materials and Technology:;2001:;volume( 123 ):;issue: 003:;page 322
    Author(s): Jianmei He; Martin Y. M. Chiang; Donald L. Hunston
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A finite element analysis (FEA) was conducted to examine the feasibility of determining the shear modulus of an adhesive in a bonded geometry using a three-point bending test on a sandwich ...
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