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RISAn Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat transfer in forced convection using a widely used computational fluid dynamics (CFD) software. In Part I ...
Forced Convection Board Level Thermal Design Methodology for Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically ...