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    Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003:;page 31011
    Author(s): Montazeri, Mahsa; Marbut, Cody J.; Huitink, David
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal ...
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