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RISThermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ...
Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on ...