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RISStress Analyses of Flip TAB Interconnects in Multi-Chip Module Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip Tape Automated Bond (FTAB) interconnect is one of the leading candidates for device to substrate interconnection in a high performance Multi-Chip Module (MCM). The TAB interconnect becomes ...
A Shape Optimal Design Methodology for Packaging Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Shape optimal design methodology has been used as a design tool in the automotive and aerospace industries for quite some time now. In the present work the hybrid natural shape optimal design ...
Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The beneficial effect of using dielectric liquid mixture in reducing temperature overshoot in pool boiling has been studied by the authors (Normington et al., 1992). The current experimental ...