Abstract: The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the ...

Abstract: Underfilling will almost certainly improve the performance of an area array assembly in drop, vibration, etc. However, depending on the selection of materials, the thermal fatigue life may easily ...

Abstract: One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). ...