Abstract: The effects of specimen geometry size on the behavior of 63Sn-37Pb solder are investigated both experimentally in the laboratory and analytically with finite-element simulations. The simulations ...

Abstract: This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60 Sn-40 Pb solder. Based ...

Abstract: This paper summarizes the results of a program to construct an internal variable viscoplastic damage model to characterize 95.5Sn–3.9Ag–0.6Cu (wt.%) lead-free solder under cyclic thermomechanical ...

Abstract: The present study examines the thermomechanical strain-rate sensitivity of eutectic 63Sn–37Pb solder over a broad range of strain-rates from 0.0002 s–1 to 200 s–1 , thus encompassing failure ...

Abstract: Miniaturization of hermetic packages has provided the incentive to develop a new family of hermetic microminiature connectors. Microminiature connectors, with a pin spacing of 1.27 mm, have ...