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    A Physics of Failure Approach to Component Placement 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 305
    Author(s): M. D. Osterman
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Traditionally, placement techniques have focused on improving rotability based on minimizing the total wire length between interconnected components. However, electronic card assembly (ECA) reliability, ...
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    Component Placement for Reliability on Conductively Cooled Printed Wiring Boards 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002:;page 149
    Author(s): M. D. Osterman; M. Pecht
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: With the increased demand for highly reliable electronic equipment and limitations that make improvements to the reliability of individual components difficult to obtain, methods to improve the ...
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