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    Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 004:;page 041004-1
    Author(s): Whitt, Reece; Hudson, Skyler; Huitink, David; Yuan, Zhao; Emon, Asif; Luo, Fang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional ...
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    Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 24502-1
    Author(s): Carlton, Hayden; Iradukunda, Ange; Imran, Asif; Myane, Sarah; Akey, Noah; Luo, Fang; Huitink, David
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As power densities and switching frequencies dramatically increase in wide bandgap power electronics, electromagnetic interference (EMI) increasingly impacts power conversion efficiency, and reliability, which requires ...
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    Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
    Author(s): Iradukunda, Ange-Christian; Kasitz, Josh; Carlton, Hayden; Huitink, David; Deshpande, Amol; Luo, Fang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a ...
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