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RISComparison of the Volume of Fluid and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The three-dimensional (3D) stacking of integrated circuits (ICs), and emergent microelectronic technologies require low-profile cooling solutions for the removal of relatively high heat fluxes. The flow boiling of dielectric ...
Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Structural flexibility has become a common feature in emerging microsystems with increasing heat fluxes. The thermal control of such applications is a significant challenge because of both structural and volumetric ...
Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The computational fluid dynamics (CFD) modeling of boiling phenomena has remained a challenge due to numerical limitations for accurately simulating the two-phase flow and phase-change processes. In the present investigation, ...
Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work is a numerical study of microfluidic cooling of integrated circuits (ICs), using embedded micropin-fins on a silicon chip. The study considers non-uniform chip heat fluxes (250–500 W/cm2) and variable pin fin ...