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RISVariable Fin Density Flow Channels for Effective Cooling and Mitigation of Temperature Nonuniformity in Three Dimensional Integrated Circuits
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The surface temperature of integrated circuit (IC) chips cooled with a singlephase liquid flow increases along the flow direction following the increase in the liquid temperature. Increasing the heat transfer coefficient ...
A Vapotron Effect Application for Electronic Equipment Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This research is aimed at investigating by experimental means a possible use of the Vapotron Effect for the cooling of electronic devices. The problem deals with a particular kind of subcooled ...
A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The problem of heat removal in energetic processes represents a big challenge especially because of the enhanced requirements of the modern industry. The thermal exchange systems therefore have ...
Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal conductance and loss of pressure are among the most relevant parameters based on which a heat exchanger has to be chosen. Starting from this observation this study treated and compared ...
A Bejan’s Constructal Theory Approach to the Overall Optimization of Heat Exchanging Finned Modules With Air in Forced Convection and Laminar Flow Condition
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Optimizing ever smaller heat exchangers determines two opposite needs: augmenting performances, on the one hand; removing heat in excess to reduce failures, on the other. This numerical study, ...
Numerical Heat Transfer Optimization in Modular Systems of Y-Shaped Fins
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper analyses the heat exchange behavior in systems characterized by Y-shaped fins through a numerical approach based on a CFD software. Starting from individual Y profiles, as optimized ...
Bejan’s Constructal Theory Analysis of Gas-Liquid Cooled Finned Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High performance heat exchangers represent nowadays the key of success to go on with the trend of miniaturizing electronic components as requested by the industry. This numerical study, based ...
Comparison of the Volume of Fluid and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The three-dimensional (3D) stacking of integrated circuits (ICs), and emergent microelectronic technologies require low-profile cooling solutions for the removal of relatively high heat fluxes. The flow boiling of dielectric ...
Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Structural flexibility has become a common feature in emerging microsystems with increasing heat fluxes. The thermal control of such applications is a significant challenge because of both structural and volumetric ...
Numerical Study of Unsteady Jeffery Fluid Flow With Magnetic Field Effect and Variable Fluid Properties
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A mathematical model has been constructed for determining the effects of variable viscosity and thermal conductivity on unsteady Jeffery flow over a stretching sheet in the presence of magnetic field and heat generation. ...