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RISFlow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Underfill encapsulation is crucial in assembling flip-chip products, such as ball grid array packages, enhancing the reliability and performance of electronic packages by filling voids between integrated circuit chips and ...
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Underfill encapsulation is crucial in assembling flip-chip products, such as ball grid array packages, enhancing the reliability and performance of electronic packages by filling voids between integrated circuit chips and ...
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, high-temperature hygroscopic swelling characterization of different epoxy mold compounds (EMCs) and dielectric build-up films (DBFs) were analyzed using an experimental technique. The approach maintains ...