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    Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005) 

    Source: Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 001:;page 17002-1
    Author(s): Cheng, Hsien-Chie; Liu, Yan-Cheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407.
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