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    Convective Cooling of Compact Electronic Devices Via Liquid Metals With Low Melting Points 

    Source: Journal of Heat Transfer:;2021:;volume( 143 ):;issue: 005:;page 050801-1
    Author(s): Liu, Gui Lin; Liu, Jing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. ...
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