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    Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001:;page 43
    Author(s): Liqiang Cao; Zonghe Lai; Johan Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and ...
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