Search
CSV
RISThe Thermoelastic Analysis of Chip-Substrate System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The presence of dissimilar material systems and thermal gradients introduces thermal stresses in multi-layered electronic assemblies and packages during fabrication and operation. The thermal stresses ...
The Elastic Field Caused by a Circular Cylindrical Inclusion—Part I: Inside the Region x12 + x22 < a2, −∞ < x3 < ∞ Where the Circular Cylindrical Inclusion is Expressed by x12 + x22 ≤ a2, −h ≤ x3 ≤ h
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The displacement and stress fields caused by uniform eigenstrains in a circular cylindrical inclusion are analyzed inside the region x12 + x22 < a2, −∞ < x3 < ∞ and are given in ...
The Elastic Field Caused by a Circular Cylindrical Inclusion—Part II: Inside the Region x12 + x22 > a2, −∞ < x3 < ∞ Where the Circular Cylindrical Inclusion is Expressed by x12 + x22 ≤ a2, −h ≤ x3 ≤ h
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Analytical solutions are presented for the displacement and stress fields caused by a circular cylindrical inclusion with arbitrary uniform eigenstrains in an infinite elastic medium. The expressions ...
Investigation of Stress Intensity Factors for an Interface Crack in Multi-Interface Materials Using an Interaction Integral Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A new interaction integral formulation is derived for obtaining mixed-mode stress intensity factors (SIFs) of an interface crack with the tip close to complicated material interfaces. The method ...