Abstract: Leadfree solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz highfrequency ...

Abstract: Kinks have a strong influence on the structural performance of wire bonds. In this study, a variablelength linkspring model has been developed to better understand kink formation. In this model, a gold wire was decomposed ...

Abstract: Aggregate occupies at least three-quarters of the volume of asphalt mixture and can significantly affect the performance of pavement. The geometrical morphology influences the slippage and interlock among aggregates for ...

Abstract: Silicon piezoresistive pressure sensors can only operate below 125 °C due to the leakage current of the PN junction. However, silicon-on-insulator (SOI) high-temperature pressure sensors use SiO2 for total dielectric ...

Abstract: With the increasing interconnect density of electronic components, copper–copper direct bonding technology has garnered increasing attention from researchers. The electroplating bonding method is an efficient copper pillar ...

Abstract: With the development of packaging devices toward high performance and high density, electronic devices are subjected to thermo-electric stresses under service conditions, which has become a particularly important reliability ...