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RISDesign of Thermal Ground Planes for Cooling of Foldable Smartphones
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of ...
Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thin vapor chambers provide a novel solution to thermal management in mobile electronics. In the pursuit of vapor chamber optimization, characterization of the wicking structure can allow for a better understanding of the ...
Design of Thermal Ground Planes for Cooling of Foldable Smartphones
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Foldable smartphones are expected to be widely commercialized in the near future. Thermal ground plane (TGP), known as vapor chamber or two-dimensional flat heat pipe, is a promising solution for the thermal management of ...
Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal ground planes (TGPs) are passive thermal management devices that utilize the phase-change of a working fluid to achieve high thermal conductivity and low thermal resistance. TGPs are flat, two-dimensional heat ...
Performance Analysis of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: JouleThomson (JT) based micro cryogenic coolers (MCCs) are attractive because they can provide the cryogenic temperatures needed for small electronic devices while having a low cost and small volumetric footprint. A ...