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RISThermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling ...
Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN on SiC Semiconductor Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...
Enhanced Heat Transfer Using Microporous Copper Inverse Opals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance ...
Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on ...
Experimental Investigation of Flow Condensation in Microgravity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Future manned space missions are expected to greatly increase the space vehicle's size, weight, and heat dissipation requirements. An effective means to reducing both size and weight is to replace singlephase thermal ...