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RISThe Strength of High Temperature Ag–In Joints Produced Between Copper by Fluxless Low Temperature Processes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two copper (Cu) substrates were bonded using silver (Ag) and indium (In) and annealed at 200–250 آ°C to convert the joints into the solid solution (Ag) for enhanced strength and ductility. Cu–Cu pair was chosen so ...
Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
Publisher: The American Society of Mechanical Engineers (ASME)