Abstract: This paper presents a novel thickness profile measuring system that measures double-sided thin pipe wall surfaces in a non-contact, continuous, cosine error-free, and fast manner. The surface metrology tool path was developed ...

Abstract: This paper presents a novel nondestructive testing system, magneto-eddy-current sensor (MECS), to enable surface profiling of dissimilar materials by combining magnetic sensing for ferromagnetic materials and eddy-current ...

Abstract: This article introduces a novel hole edge inspection and metrology technology by edge diffractometry, which occurs when light interacts with the hole edge. The proposed method allows for simultaneous characterization of ...

Abstract: This paper presents a novel method to eliminate cosine error in precision concave and convex surface measurement by integrating a displacement probe in a precision spindle. Cosine error in surface profile measurement comes ...

Abstract: This paper introduces a novel wafer-edge quality inspection method based on analysis of curved-edge diffractive fringe patterns, which occur when light is incident and diffracts around the wafer edge. The proposed method ...

Abstract: In smart manufacturing, semiconductors play an indispensable role in collecting, processing, and analyzing data, ultimately enabling more agile and productive operations. Given the foundational importance of wafers, the ...