Abstract: Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was ...

Abstract: The heat-transfer characteristics of 128 small-sized plate-fin heat sinks in a supercomputer chassis are investigated with CFD simulation. The V-shaped curves of the chip temperature versus fin ...

Abstract: The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited ...