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RISCo-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional ...
Recent Advances and New Trends in Flip Chip Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past ...
Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die ...