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    Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 314
    Author(s): Peter A. Engel; Kee Rong Wu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The role of the solder joint as an elastic foundation is investigated first for structural analysis of the pin. Failure mechanisms are discussed. For various pin cross sections, guidelines for ...
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    Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads 

    Source: Journal of Manufacturing Science and Engineering:;1998:;volume( 120 ):;issue: 002:;page 279
    Author(s): P. A. Engel; Stan Janisiewicz; Kee Rong Wu; Xuejun Zhai
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As various small electronics components are being rapidly moved along an assembly line, their leads must be cut and clinched into holes of a circuit board for the next soldering operation. ...
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    Wear of Physical Vapor Deposition TiN Coatings Sliding Against Cr-Steel and WC Counterbodies 

    Source: Journal of Tribology:;1998:;volume( 120 ):;issue: 003:;page 482
    Author(s): Kee-Rong Wu; Raymond G. Bayer; Peter A. Engel; D. C. Sun
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Cutting tools are often coated with titanium nitride (TiN) for its good wear resistance. The method of coating by physical vapor deposition (PVD) has many superior features over other methods ...
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